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The technology will offer supportless DIW of complex structures using vinyl ester resin, facilitated by multidirectional 6 axis printing.
The technologies provide additively manufactured thermal protection system.
Reflective and emissive surfaces are designed with heat retention as opposed to the current state of the art oven and furnaces which use non-reflective surfaces. Heat is absorbed and transferred to the exterior of the heated appliances.
This invention focuses on improving the ceramic yield of preceramic polymers by tuning the crosslinking process that occurs during vat photopolymerization (VP).
Using all polymer formulations, the PIP densification is improved almost 70% over traditional preceramic polymers and PIP material leading to cost and times saving for densifying ceramic composites made from powder or fibers.
The technologies provide a system and method of needling of veiled AS4 fabric tape.
Fiberglass, semi-structural insulation for recycled glass fiber and using a low cost silicon with pultruded rods, either fiberglass and a low cost resin, polyester for pultruded rods. It will reduce the use of wood, which is flammable, and still be structural.
When a magnetic field is applied to a type-II superconductor, it penetrates the superconductor in a thin cylindrical line known as a vortex line. Traditional methods to manipulate these vortices are limited in precision and affect a broad area.
Molecular Beam Epitaxy is a traditional technique for the synthesis of thin film materials used in the semiconducting and microelectronics industry. In its essence, the MBE technique heats crucibles filled with ultra-pure atomic elements under ultra high vacuum condition
The ID provides a solution approach for faster chemical processing and carbon functional grading from SiC to MC to provide a tougher carbon and CMC structure.