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Researcher
- Vandana Rallabandi
- Subho Mukherjee
- Rama K Vasudevan
- Burak Ozpineci
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- Lingxiao Xue
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Stacked die in power electronics refers to a packaging approach where multiple semiconductor dies are vertically integrated or "stacked" in a single package.

Dual-GP addresses limitations in traditional GPBO-driven autonomous experimentation by incorporating an additional surrogate observer and allowing human oversight, this technique improves optimization efficiency via data quality assessment and adaptability to unanticipated exp

High-gradient magnetic filtration (HGMF) is a non-destructive separation technique that captures magnetic constituents from a matrix containing other non-magnetic species. One characteristic that actinide metals share across much of the group is that they are magnetic.

Misalignment issues of the PWPT system have been addressed. The intercell power transformer has been introduced in order to improve load sharing of the system during a mismatch of the primary single-phase coil and the secondary multi-phase coils.

Induction cooktops are becoming popular; however, a limitation is that compatible cookware is required. This is a significant barrier to its adoption.

The invention presented here addresses key challenges associated with counterfeit refrigerants by ensuring safety, maintaining system performance, supporting environmental compliance, and mitigating health and legal risks.

The invention integrates conductive and inductive charging in a single electric vehicle charger.

The invention discusses charging coil designs that can be utilized as a transformer for plug in EV charging, as well as inductive coils for wireless charging.

V-Cr-Ti alloys have been proposed as candidate structural materials in fusion reactor blanket concepts with operation temperatures greater than that for reduced activation ferritic martensitic steels (RAFMs).

A novel method that prevents detachment of an optical fiber from a metal/alloy tube and allows strain measurement up to higher temperatures, about 800 C has been developed. Standard commercial adhesives typically only survive up to about 400 C.