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Stacked die in power electronics refers to a packaging approach where multiple semiconductor dies are vertically integrated or "stacked" in a single package.
This technology can help to increase number of application areas of Wireless Power Transfer systems. It can be applied to consumer electronics, defense industry, automotive industry etc.
A new, simpler power module and manifold design shows lower weight and volume, which allows higher power density compared with current state of the art.
There is a strong drive to improve the electrical performance of a power module for power electronics applications including transportation, buildings, renewables, and power delivery.
ORNL has developed a revolutionary system for wirelessly transferring power to electric vehicles and energy storage systems, enabling efficient, contactless charging.