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Researcher
- Vandana Rallabandi
- Subho Mukherjee
- Burak Ozpineci
- Gui-Jia Su
- Omer Onar
- Shajjad Chowdhury
- Ying Yang
- Gurneesh Jatana
- Mostak Mohammad
- Sam Hollifield
- Veda Prakash Galigekere
- Alice Perrin
- Chad Steed
- Costas Tsouris
- Himel Barua
- James Szybist
- Jonathan Willocks
- Junghoon Chae
- Mingyan Li
- Pedro Ribeiro
- Rafal Wojda
- Steven J Zinkle
- Todd Toops
- Travis Humble
- Yanli Wang
- Yeonshil Park
- Yutai Kato
- Aaron Werth
- Alexander I Wiechert
- Alexey Serov
- Alex Plotkowski
- Ali Passian
- Amit Shyam
- Benjamin Lawrie
- Benjamin Manard
- Ben Lamm
- Beth L Armstrong
- Brian Weber
- Bruce A Pint
- Charles F Weber
- Chengyun Hua
- Christopher Ledford
- David S Parker
- Derek Splitter
- Dhruba Deka
- Diana E Hun
- Emilio Piesciorovsky
- Erdem Asa
- Gabor Halasz
- Gary Hahn
- Gerry Knapp
- Gina Accawi
- Gs Jung
- Gyoung Gug Jang
- Haiying Chen
- Harper Jordan
- Hongbin Sun
- Isaac Sikkema
- James A Haynes
- Jason Jarnagin
- Jiaqiang Yan
- Joanna Mcfarlane
- Joel Asiamah
- Joel Dawson
- Jong K Keum
- Jon Wilkins
- Joseph Olatt
- Kevin Spakes
- Kunal Mondal
- Lilian V Swann
- Lingxiao Xue
- Luke Koch
- Mahim Mathur
- Mark M Root
- Mark Provo II
- Mary A Adkisson
- Matt Vick
- Meghan Lamm
- Melanie Moses-DeBusk Debusk
- Michael Kirka
- Mina Yoon
- Nance Ericson
- Nicholas Richter
- Nishanth Gadiyar
- Oscar Martinez
- Patxi Fernandez-Zelaia
- Petro Maksymovych
- Philip Boudreaux
- Praveen Cheekatamarla
- Praveen Kumar
- Radu Custelcean
- Raymond Borges Hink
- Rob Root
- Ryan Dehoff
- Samudra Dasgupta
- Sreshtha Sinha Majumdar
- Srikanth Yoginath
- Sumit Bahl
- Sunyong Kwon
- Tim Graening Seibert
- T Oesch
- Tolga Aytug
- Varisara Tansakul
- Venkatakrishnan Singanallur Vaidyanathan
- Vishaldeep Sharma
- Vivek Sujan
- Weicheng Zhong
- Wei Tang
- William P Partridge Jr
- Xiang Chen
- Xiang Lyu
- Yan-Ru Lin
- Yarom Polsky

Stacked die in power electronics refers to a packaging approach where multiple semiconductor dies are vertically integrated or "stacked" in a single package.

High-gradient magnetic filtration (HGMF) is a non-destructive separation technique that captures magnetic constituents from a matrix containing other non-magnetic species. One characteristic that actinide metals share across much of the group is that they are magnetic.

Technologies are described directed to multi-harmonic brushless excitation systems for wound-field synchronous machines.

Misalignment issues of the PWPT system have been addressed. The intercell power transformer has been introduced in order to improve load sharing of the system during a mismatch of the primary single-phase coil and the secondary multi-phase coils.

Induction cooktops are becoming popular; however, a limitation is that compatible cookware is required. This is a significant barrier to its adoption.

The ever-changing cellular communication landscape makes it difficult to identify, map, and localize commercial and private cellular base stations (PCBS).

The invented alloys are a new family of Al-Mg alloys. This new family of Al-based alloys demonstrate an excellent ductility (10 ± 2 % elongation) despite the high content of impurities commonly observed in recycled aluminum.

Method to operate a compression ignition engine in dual fuel operation with premixed turbulent flame propagation from low to high loads.

The invention presented here addresses key challenges associated with counterfeit refrigerants by ensuring safety, maintaining system performance, supporting environmental compliance, and mitigating health and legal risks.

We have been working to adapt background oriented schlieren (BOS) imaging to directly visualize building leakage, which is fast and easy.