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Stacked die in power electronics refers to a packaging approach where multiple semiconductor dies are vertically integrated or "stacked" in a single package.
Technologies are described directed to package Integration of rotor position sensor in rotary transformer.
Technologies directed to integration of an inductive position sensor in a rotary transformer are described.
A new, simpler power module and manifold design shows lower weight and volume, which allows higher power density compared with current state of the art.
Additively manufacturing of the windings with a conductor distributed in the cross-section according to the Hilbert curve provides many benefits as it allows for the reduction of the high-frequency losses due to the reduction of the effective winding conductor size.