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- Soydan Ozcan
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Dual-GP addresses limitations in traditional GPBO-driven autonomous experimentation by incorporating an additional surrogate observer and allowing human oversight, this technique improves optimization efficiency via data quality assessment and adaptability to unanticipated exp

Misalignment issues of the PWPT system have been addressed. The intercell power transformer has been introduced in order to improve load sharing of the system during a mismatch of the primary single-phase coil and the secondary multi-phase coils.

Wind turbine blades face a harsh environment in which erosion of the leading edge is a major factor for in-use maintenance. Current industrial practices to address this leading edge erosion are replacement of reinforcing materials upon significant damage infliction.

Through utilizing a two function splice we can increase the splice strength for opposing tows.
Contact:
To learn more about this technology, email partnerships@ornl.gov or call 865-574-1051.

We proposed and developed a carbon nanofiber (CNF) suspension-based sizing agent, that resulted in improved interfacial, and mechanical properties. The CNF dispersed sizing agent can be applied in a relatively simpler way (by passing the continuous tow through it).

The technologies polymer cellulose nanocomposite mats and process for making same.
Contact
To learn more about this technology, email partnerships@ornl.gov or call 865-574-1051.

The invention introduces a novel, customizable method to create, manipulate, and erase polar topological structures in ferroelectric materials using atomic force microscopy.

The use of biomass fiber reinforcement for polymer composite applications, like those in buildings or automotive, has expanded rapidly due to the low cost, high stiffness, and inherent renewability of these materials. Biomass are commonly disposed of as waste.

High coercive fields prevalent in wurtzite ferroelectrics present a significant challenge, as they hinder efficient polarization switching, which is essential for microelectronic applications.