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The technology will offer supportless DIW of complex structures using vinyl ester resin, facilitated by multidirectional 6 axis printing.
The technologies provide additively manufactured thermal protection system.
Reflective and emissive surfaces are designed with heat retention as opposed to the current state of the art oven and furnaces which use non-reflective surfaces. Heat is absorbed and transferred to the exterior of the heated appliances.
This invention focuses on improving the ceramic yield of preceramic polymers by tuning the crosslinking process that occurs during vat photopolymerization (VP).
Using all polymer formulations, the PIP densification is improved almost 70% over traditional preceramic polymers and PIP material leading to cost and times saving for densifying ceramic composites made from powder or fibers.
The technologies provide a system and method of needling of veiled AS4 fabric tape.
Fiberglass, semi-structural insulation for recycled glass fiber and using a low cost silicon with pultruded rods, either fiberglass and a low cost resin, polyester for pultruded rods. It will reduce the use of wood, which is flammable, and still be structural.
High and ultra-high vacuum applications require seals that do not allow leaks. O-rings can break down over time, due to aging and exposure to radiation. Metallic seals can damage sealing surfaces, making replacement of the original seal very difficult.
The ID provides a solution approach for faster chemical processing and carbon functional grading from SiC to MC to provide a tougher carbon and CMC structure.
The solution proposed here is a modified carbon-based tile face that is mechanically combined with an insulative backing. The tile face is based on a material architecture to minimize weight and thermal conductivity while maximizing thermal stability.