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Researcher
- Andrzej Nycz
- Sheng Dai
- Amit Shyam
- Beth L Armstrong
- Chris Masuo
- Parans Paranthaman
- Peeyush Nandwana
- Bishnu Prasad Thapaliya
- Brian Post
- Peter Wang
- Ying Yang
- Zhenzhen Yang
- Alex Plotkowski
- Alex Walters
- Craig A Bridges
- Edgar Lara-Curzio
- Jun Qu
- Rangasayee Kannan
- Ryan Dehoff
- Shannon M Mahurin
- Sudarsanam Babu
- Yong Chae Lim
- Zhili Feng
- Adam Willoughby
- Alice Perrin
- Blane Fillingim
- Brian Gibson
- Bruce A Pint
- Christopher Ledford
- Corson Cramer
- David S Parker
- Eric Wolfe
- Ilja Popovs
- James A Haynes
- Jian Chen
- Joshua Vaughan
- Lauren Heinrich
- Li-Qi Qiu
- Luke Meyer
- Meghan Lamm
- Michael Kirka
- Rishi Pillai
- Rob Moore II
- Saurabh Prakash Pethe
- Steve Bullock
- Steven J Zinkle
- Sumit Bahl
- Thomas Feldhausen
- Tolga Aytug
- Tomas Grejtak
- Udaya C Kalluri
- Uday Vaidya
- William Carter
- Yanli Wang
- Yousub Lee
- Yutai Kato
- Adam Stevens
- Ahmed Hassen
- Akash Jag Prasad
- Alexei P Sokolov
- Andres Marquez Rossy
- Andrew F May
- Anees Alnajjar
- Ben Garrison
- Ben Lamm
- Brad Johnson
- Brandon Johnston
- Brian Sales
- Bruce Moyer
- Bryan Lim
- Calen Kimmell
- Charles Hawkins
- Chelo Chavez
- Christopher Fancher
- Chris Tyler
- Clay Leach
- Costas Tsouris
- David J Mitchell
- Dean T Pierce
- Ethan Self
- Frederic Vautard
- Gabriel Veith
- Gerry Knapp
- Glenn R Romanoski
- Gordon Robertson
- Govindarajan Muralidharan
- Gs Jung
- Gyoung Gug Jang
- Hsin Wang
- J.R. R Matheson
- James Klett
- Jayanthi Kumar
- Jaydeep Karandikar
- Jay Reynolds
- Jeff Brookins
- Jesse Heineman
- Jiheon Jun
- John Potter
- Jong K Keum
- Jordan Wright
- Jovid Rakhmonov
- Kaustubh Mungale
- Khryslyn G Araño
- Marie Romedenne
- Marm Dixit
- Matthew Brahlek
- Matthew S Chambers
- Mike Zach
- Mina Yoon
- Nageswara Rao
- Nancy Dudney
- Nedim Cinbiz
- Nicholas Richter
- Nidia Gallego
- Patxi Fernandez-Zelaia
- Phillip Halstenberg
- Priyanshi Agrawal
- Radu Custelcean
- Riley Wallace
- Ritin Mathews
- Roger G Miller
- Rose Montgomery
- Santa Jansone-Popova
- Sarah Graham
- Sergiy Kalnaus
- Shajjad Chowdhury
- Subhamay Pramanik
- Sunyong Kwon
- Tao Hong
- Thomas R Muth
- Tim Graening Seibert
- Tomonori Saito
- Trevor Aguirre
- Venugopal K Varma
- Vincent Paquit
- Vladimir Orlyanchik
- Vlastimil Kunc
- Weicheng Zhong
- Wei Tang
- Wei Zhang
- William Peter
- Xiang Chen
- Xiaohan Yang
- Yan-Ru Lin
- Yiyu Wang
- Yukinori Yamamoto

A finite element approach integrated with a novel constitute model to predict phase change, residual stresses and part deformation.

A novel strategy was developed to solve the limitations of the current sorbent systems in CO2 chemisorption in terms of energy consumption in CO2 release and improved CO2 uptake capacity.

Currently available cast Al alloys are not suitable for various high-performance conductor applications, such as rotor, inverter, windings, busbar, heat exchangers/sinks, etc.

The invented alloys are a new family of Al-Mg alloys. This new family of Al-based alloys demonstrate an excellent ductility (10 ± 2 % elongation) despite the high content of impurities commonly observed in recycled aluminum.

This invention introduces a novel sintering approach to produce hard carbon with a finely tuned microstructure, derived from biomass and plastic waste.

System and method for part porosity monitoring of additively manufactured components using machining
In additive manufacturing, choice of process parameters for a given material and geometry can result in porosities in the build volume, which can result in scrap.

V-Cr-Ti alloys have been proposed as candidate structural materials in fusion reactor blanket concepts with operation temperatures greater than that for reduced activation ferritic martensitic steels (RAFMs).

The lack of real-time insights into how materials evolve during laser powder bed fusion has limited the adoption by inhibiting part qualification. The developed approach provides key data needed to fabricate born qualified parts.

A novel method that prevents detachment of an optical fiber from a metal/alloy tube and allows strain measurement up to higher temperatures, about 800 C has been developed. Standard commercial adhesives typically only survive up to about 400 C.