1 - 10 of 63 Results
Stacked die in power electronics refers to a packaging approach where multiple semiconductor dies are vertically integrated or "stacked" in a single package.
Dual-GP addresses limitations in traditional GPBO-driven autonomous experimentation by incorporating an additional surrogate observer and allowing human oversight, this technique improves optimization efficiency via data quality assessment and adaptability to unanticipated exp
High-gradient magnetic filtration (HGMF) is a non-destructive separation technique that captures magnetic constituents from a matrix containing other non-magnetic species. One characteristic that actinide metals share across much of the group is that they are magnetic.
A finite element approach integrated with a novel constitute model to predict phase change, residual stresses and part deformation.
Misalignment issues of the PWPT system have been addressed. The intercell power transformer has been introduced in order to improve load sharing of the system during a mismatch of the primary single-phase coil and the secondary multi-phase coils.
Induction cooktops are becoming popular; however, a limitation is that compatible cookware is required. This is a significant barrier to its adoption.
Currently available cast Al alloys are not suitable for various high-performance conductor applications, such as rotor, inverter, windings, busbar, heat exchangers/sinks, etc.
The invented alloys are a new family of Al-Mg alloys. This new family of Al-based alloys demonstrate an excellent ductility (10 ± 2 % elongation) despite the high content of impurities commonly observed in recycled aluminum.
The invention presented here addresses key challenges associated with counterfeit refrigerants by ensuring safety, maintaining system performance, supporting environmental compliance, and mitigating health and legal risks.
The invention integrates conductive and inductive charging in a single electric vehicle charger.