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Researcher
- Brian Post
- Peter Wang
- Alex Plotkowski
- Amit Shyam
- Andrzej Nycz
- Rafal Wojda
- Blane Fillingim
- Chris Masuo
- Peeyush Nandwana
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- Sudarsanam Babu
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- Ahmed Hassen
- Christopher Fancher
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- James A Haynes
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- Ryan Dehoff
- Sumit Bahl
- Vandana Rallabandi
- Yousub Lee
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- Jovid Rakhmonov
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- Marcio Magri Kimpara
- Michael Borish
- Mostak Mohammad
- Nicholas Richter
- Omer Onar
- Praveen Kumar
- Rangasayee Kannan
- Ritin Mathews
- Roger G Miller
- Sarah Graham
- Scott Smith
- Shajjad Chowdhury
- Steven Guzorek
- Subho Mukherjee
- Suman Debnath
- Sunyong Kwon
- Vlastimil Kunc
- William Carter
- William Peter
- Ying Yang
- Yukinori Yamamoto

Misalignment issues of the PWPT system have been addressed. The intercell power transformer has been introduced in order to improve load sharing of the system during a mismatch of the primary single-phase coil and the secondary multi-phase coils.

Currently available cast Al alloys are not suitable for various high-performance conductor applications, such as rotor, inverter, windings, busbar, heat exchangers/sinks, etc.

The invented alloys are a new family of Al-Mg alloys. This new family of Al-based alloys demonstrate an excellent ductility (10 ± 2 % elongation) despite the high content of impurities commonly observed in recycled aluminum.

This manufacturing method uses multifunctional materials distributed volumetrically to generate a stiffness-based architecture, where continuous surfaces can be created from flat, rapidly produced geometries.

The lack of real-time insights into how materials evolve during laser powder bed fusion has limited the adoption by inhibiting part qualification. The developed approach provides key data needed to fabricate born qualified parts.

A valve solution that prevents cross contamination while allowing for blocking multiple channels at once using only one actuator.

Materials produced via additive manufacturing, or 3D printing, can experience significant residual stress, distortion and cracking, negatively impacting the manufacturing process.

An ORNL invention proposes using 3D printing to make conductors with space-filling thin-wall cross sections. Space-filling thin-wall profiles will maximize the conductor volume while restricting the path for eddy currents induction.

This work seeks to alter the interface condition through thermal history modification, deposition energy density, and interface surface preparation to prevent interface cracking.