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- Vladimir Orlyanchik
- William Peter
- Xiaobing Liu
- Yan-Ru Lin
- Ying Yang
- Yukinori Yamamoto
- Zhiming Gao

The technology will offer supportless DIW of complex structures using vinyl ester resin, facilitated by multidirectional 6 axis printing.

Dual-GP addresses limitations in traditional GPBO-driven autonomous experimentation by incorporating an additional surrogate observer and allowing human oversight, this technique improves optimization efficiency via data quality assessment and adaptability to unanticipated exp

The technologies provide additively manufactured thermal protection system.

System and method for part porosity monitoring of additively manufactured components using machining
In additive manufacturing, choice of process parameters for a given material and geometry can result in porosities in the build volume, which can result in scrap.

Reflective and emissive surfaces are designed with heat retention as opposed to the current state of the art oven and furnaces which use non-reflective surfaces. Heat is absorbed and transferred to the exterior of the heated appliances.

This invention focuses on improving the ceramic yield of preceramic polymers by tuning the crosslinking process that occurs during vat photopolymerization (VP).

Distortion generated during additive manufacturing of metallic components affect the build as well as the baseplate geometries. These distortions are significant enough to disqualify components for functional purposes.

The invention introduces a novel, customizable method to create, manipulate, and erase polar topological structures in ferroelectric materials using atomic force microscopy.

For additive manufacturing of large-scale parts, significant distortion can result from residual stresses during deposition and cooling. This can result in part scraps if the final part geometry is not contained in the additively manufactured preform.

High coercive fields prevalent in wurtzite ferroelectrics present a significant challenge, as they hinder efficient polarization switching, which is essential for microelectronic applications.