Junction Temperature Measurement of IGBTs Using Short Circuit Current Conference Paper September, 2012
Planar Bond All: A New Packaging Technology for Advanced Automotive Power Modules... Conference Paper September, 2012
Planar Bond All: A New Packaging Technology for Advanced Automotive Power Modules... Conference Paper September, 2012
Real Power and Reactive Power Control of a Three-Phase Single-Stage-PV System and PV voltage Stability... Conference Paper July, 2012
Air Conditioning Stall Phenomenon – Testing, Model Development, and Simulation Conference Paper May, 2012
Reducing Parasitic Electrical Parameters with a Planar Interconnection Packaging Structure... Conference Paper March, 2012
Si IGBT Phase-Leg Module Packaging and Cooling Design for Operation at 200ËšC in Hybrid Electrical Vehicle Applications Conference Paper February, 2012
Power Module and Cooling System Thermal Performance Evaluation for HEV Application Conference Paper February, 2012
Autonomous and Adaptive Voltage Control using Multiple Distributed Energy Resources... Journal January, 2012
